“TSMC had mulled setting up its 3nm wafer fab in the US due mainly to the availability of stable power supply there. For any 12-inch wafer plant, more advanced process requires higher power consumption, with electricity consumed by 3nm process likely to double that by 5nm process. Accordingly, after a massive power outage occurred on August 15, 2017 around Taiwan, doubts had deepened over whether Taiwan’s power supply could secure normal operation of a 3nm wafer fab in the country.”
See Commentary: Triple-win decision for TSMC to build 3nm wafer fab in TaiwanFor a guy currently running some 45nm kit, it’s exciting to see Taiwan head for 3nm. That’s just a few atoms in size. That’s competitive with the world. That allows all kinds of choices for chips. Imagine how many ARMed cores one could build with that kind of resolution. It’s mind-boggling. I can see solar-powered smartphones real soon now. I can see all kinds of computer-equipment getting some power from ambient lighting, RF or even body-heat.
I’m zeroing in on some 10nm equipment. I doubt I can wait for 3nm but it gives me room for future growth of IT in my property. It’s all good to have choices.